Bump Wafer
凸点（Bump Wafer）
· Bump Structure
§ 1P1M, Pillar on Pad with PI
§ 2P2M, Pillar on RDL with UBM
· Process Capabilities
§ Bumping packaging service (6 inch, 8 inch and 12 inch)
§ Dielectric material: PI
§ UBM: Ti/Cu/Ni sputtering target, Cu/Ni plating
§ RDL Line/Space: min. 5um/5um
§ Cu Pillar Pitch: min. 50um
§ Sn-Ag Bump Pitch: min. 100um
§ Pillar Pitch: 0.5mm
Call Us
+86 0757-8625 1566
+86 159 8906 6199
Our Email
sales@plutochip.comOur Address
Head Office：Rm 1815, Building 3, CML Center, No. 26 Guilan North Rd, Nanhai District, Foshan City, China Factory：Wanma Industries Park, Gaoming District, Foshan City, China
