TSV Wafer
· TSV Wafer
§ 10 x 100um Void free filling
§ Min. 40um pitch of micro bump
§ 2-layer RDL routing layout
§ RDL Line/Space: min.10um/10um
§ Refilling Materials: Cu and Polysilicon
· Process Capabilities
§ Make holes
§ Refilling
§ CMP
§ Wafer thinning
§ Low cost via reveal
Call Us
+86 0757-8625 1566
+86 159 8906 6199
Our Email
sales@plutochip.comOur Address
Head Office：Rm 1815, Building 3, CML Center, No. 26 Guilan North Rd, Nanhai District, Foshan City, China Factory：Wanma Industries Park, Gaoming District, Foshan City, China
