We offer a wide range of customized substrate wafers tailored to customer specifications, including silicon wafers, glass and quartz wafers, SOI/CSOI, epitaxial wafers and other compound semiconductor substrates.

High-precision photomask blanks and custom mask fabrication services for advanced lithography processes. We supply mask blanks in multiple grades with strict defect, phase, and transmittance specifications.

We operate a diverse range of thin film deposition systems, offering both CVD and PVD capabilities. Our services cover the deposition of various metallic and non-metallic films to meet your specific process requirements.

We possess lithography systems of various models, enabling us to select the optimal equipment for your specific process requirements and deliver customized fabrication solutions. Our capabilities span from 4-inch to 8-inch wafer processing.

We utilize a diverse portfolio of etching equipment to deliver various etching solutions, ensuring our services always offer exceptional cost-effectiveness. Our systems cover DRIE, ICP, RIE, IBE, and both isotropic and selective dry etching processes.

We possess a variety of ion implantation systems, enabling us to provide tailored ion implantation services that meet your specific requirements. Our equipment covers high current, high energy, and medium current implantation up to 12-inch wafer sizes.

We offer customized semiconductor packaging services tailored to your needs, featuring precise control over via diameters and aspect ratios. Our expertise includes advanced TSV (Through-Silicon Via) and TGV (Through-Glass Via) processes with Copper and Polysilicon refill, ensuring high-quality solutions for complex packaging requirements.